Electrical Features
Rated voltage Ue: 240/415V
Rated current ln: 32, 40, 50, 63, 80, 100,125A
Rated frequency: 50/60Hz
Rated impulse withstand voltage (1.2/50)Uimp: 4000V
Rated short-time withstand current lcw: 12le, 1s
Rated making and breaking capacity: 3le, 1.05Ue, cosφ =0.65
Rated short circuit making capacity: 20le, t=0.1s
Dielectric test voltage at ind. Freq. For 1min: 2.5kV
Insulation voltage Ui: 500V
Pollution degree: 2
Uilization category: AC-22A
Mechanical Features
Electrical life: 1, 500
Mechanical life: 8, 500
Protection degree: I P20
Ambient temperature (with daily average≤ 35º C): -5º C...+40º C
Storage temperation: -25º C...+70º C
Installation
Terminal connection type: Cable/U-type busbar/Pin-type busbar
Terminal size top/bottom for cable: 50mm2 18-1/0AWG
Terminal size top/bottom for busbar: 50mm2 18-1/0AWG
Tightening torque 2.5 N*m 22In-Ibs....
Connection: From top and bottom
Dimensions(mm)
About US:Â
Changan Group Co.,Ltd was established at years of 1987,which is leading of industrial electric appliances,integrating the research&development,manufacture,trade,information service functions together. At present,group have passed ISO9001,ISO14001,OHASA18001 and acquired 3C certification for all products,all of our export product are strictly production according to ISO9001 and IEC standard,some product had got CE,CB,SMEKO,KEMA certification.The company has owned 10 son companies,50 sales branch,3000 employees ,areas of 0.4 million square meters,registered capital reached 26 million,yearly out put value reached 346 million.The company has the honor to be titled as "China star enterprise","China top 500 private enterprise","China top 500 in machinery industry","China top 10 of LV electric appliance"
Shipping:Â
1,Shipping can delivery by sea,air,or express according to customer requirement
Payment:Â
1. Small order under 3000USD T/T100% in advance
2. 30% deposit and 70% before shipping or after received copy of B/L
3. L/C also acceptable
Warranty:Â
1.We provide 1.5 year warranty.
2. Compensation will be paid if product had badly quality problem.Â
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Hdi Pcb
HDI Pcb Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
Key HDI PCB Benefits
The evolution of high density PCB technology has given engineers greater design freedom and flexibility than ever before. Designers now have the ability to place more components on both sides of the raw PCB if desired. In essence, an HDI PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This ultimately results in faster signal transmission along with enhanced signal quality.
HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as enhancing the electrical performance of the device. It's regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices as well as various electronic aircraft parts and components.
Over the course of a decade in business, Topscom has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.
HDI Structures |
Type of Micro vias |
Mass Production |
Small-Middle Batch |
Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 |
Blind/Buried staggered vias |
Yes | Yes | Yes | 6 layers+ |
2+N+2 |
Blind/Buried stacked vias |
Yes | Yes | Yes | 6 layers+ |
3+N+3 |
Blind/Buried staggered vias |
/ | Yes | Yes | 8 layers+ |
3+N+3 |
Blind/Buried stacked vias |
/ | / | Yes | 8 layers+ |
Check our HDI PCB capabilities by reviewing the table found below:
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 - 24layers |
Order Quantity | 1pc - 10000+pcs |
Build Time | 2days - 5weeks |
Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm - 3.0mm |
Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish |
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP - Organic Solderability Preservatives - RoHS |
Min Annular Ring | 4mil, 3mil - laser drill |
Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques |
Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²) |
HDI Pcb
Hdi Pcb,Hdi Pcb Boards,Hdi Pcb Printed Circuit Boards
Topscom Technology Co., Ltd. , http://www.pcbassemblycn.com