Since the high-power LED has a number of times higher than the low-power LED, the temperature rise will cause the flash rate to drop sharply. The specific internal substantive significance is to reduce the thermal impedance of the chip to the package, to limit the thermal impedance of the package to the printed circuit board, and to improve the smooth and smooth heat dissipation of the chip. The most important thing is to find ways to reduce the thermal impedance and improve heat dissipation.
Click to download: Detailed explanation of several ways to improve LED heat dissipation performance
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