Recently, Dongguan Qinshang Optoelectronics Co., Ltd. "New High Thermal Conductive LED Package Substrate and Modular Light Source" project was listed as the second batch of Guangdong Province strategic emerging industry special fund LED industry project, and received 10 million yuan of special financial support funds. Renminbi.
The project “New High Thermal Conductive LED Package Substrate and Modular Light Source†is jointly researched by Guangdong Industrial Technology Research Institute, Tsinghua University and South China Normal University. It uses CVD technology to prepare diamond thick film material and PEVCD technology to prepare diamond film material. Powder metallurgy technology development of fully dense diamond/copper composite materials. The application of three new high thermal conductivity materials in LED package substrates can meet the needs of different high, medium and low grade products, and has a very broad application prospect.
Diligence said that through the application technology innovation of the new high thermal conductivity LED package substrate in the LED modular light source, it forms a modular light source with completely independent intellectual property rights, excellent performance, low production cost, convenient maintenance, easy installation and convenient upgrade. At the same time, through the wide application of new high thermal conductivity materials in LED package substrates, it will greatly improve the heat dissipation performance and enhance the international market competitiveness of Chinese LED products.
The project “New High Thermal Conductive LED Package Substrate and Modular Light Source†is jointly researched by Guangdong Industrial Technology Research Institute, Tsinghua University and South China Normal University. It uses CVD technology to prepare diamond thick film material and PEVCD technology to prepare diamond film material. Powder metallurgy technology development of fully dense diamond/copper composite materials. The application of three new high thermal conductivity materials in LED package substrates can meet the needs of different high, medium and low grade products, and has a very broad application prospect.
Diligence said that through the application technology innovation of the new high thermal conductivity LED package substrate in the LED modular light source, it forms a modular light source with completely independent intellectual property rights, excellent performance, low production cost, convenient maintenance, easy installation and convenient upgrade. At the same time, through the wide application of new high thermal conductivity materials in LED package substrates, it will greatly improve the heat dissipation performance and enhance the international market competitiveness of Chinese LED products.
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