[Source: Gaogong LED 's " LED Good Products" magazine March issue reporter / Long Zonghui]
At present, the COB package structure has gradually matured in technology, and the product structure, size, and model have also appeared relatively standardized products. At the same time, everyone is researching new COB-derived structures, making heat dissipation, process simpler, and lower cost based on improved light efficiency.
From the current market reaction, the device has gradually entered the mass production plan of large-scale packaging enterprises. From Citizen, Sharp, Japan, which is the first to participate in COB, to the current American Curry, many LED lighting giants have also developed COB-based light sources. The solution, the market also began to provide matching reflectors, lenses and other accessories.
“COB is mostly packaged in small chips, and the price per watt is very close to the price of a single high-power chip.†In the view of Fu Xiaohui, general manager of Shenzhen Huagao Optoelectronics Technology Co., Ltd. (hereinafter referred to as “Hua Gao Optoelectronicsâ€), 9W The overall cost advantages of the above COB solutions are gradually emerging, and it is easier to implement a light engine solution.
Original MRCOB technology
"The key to the breakthrough in the efficacy of our packaged devices lies in our patent - MRCOB's new packaging technology." Fu Xiaohui said that MRCOB belongs to COB's fourth-generation upgrade technology, which directly places the chip in Substrate heat sinking on metal, which shortens the heat dissipation path, reduces thermal resistance, improves heat dissipation, and effectively reduces the junction temperature of the light-emitting chip. At the same time, it overcomes many technical problems such as the structure, materials and processes of previous generations of MCOB products.
" Reflector is the meaning of reflection. It is the light that will be collected to the maximum extent. The light in the light source is better reflected by the CAE professional design analysis platform." Fu Xiaohui said that by mimicking the structure of the reflector, the light extraction efficiency can be improved. . At present, the company's laboratory products have exceeded 178lm/, and are currently seeking ways to further reduce costs. At the same time, the MRCOB packaged device has formed mass production capability, and the light efficiency has exceeded 120 lm/W, indicating that it has reached 80.
In the product line, Huagao Optoelectronics packaged devices have introduced three series of products: copper substrate, aluminum substrate and ceramic substrate.
Fu Xiaohui introduced that the current X series aluminum substrate products have exceeded 120lm/W under the condition of 80. The copper substrate is basically the same as the aluminum substrate in light efficiency, but the price is slightly higher, but the heat dissipation will be better. Especially in the case of small volume, the advantage is obvious. The T-series ceramic substrate MRCOB products are currently under the condition of 80, the light efficiency has exceeded 110lm/W.
Encapsulating peripherals opportunities
After years of development, the LED industry has gradually entered the stage of scale, and production efficiency, product quality and cost control are the first issues that enterprises need to consider.
From 2000 to 2005, it was the budding stage of domestic packaging equipment. The packaging practice of small workshops gave a certain development space for domestically produced equipment.
From 2005 to 2010, especially after 2008, the LED lighting industry gradually gained the attention of governments at all levels in mainland China. During the period, semi-automated packaging equipment became popular. Many domestic packaging equipment companies chose to introduce simple and low-grade domestic applications. Cost, semi-automated equipment.
After 2010, the demand for fully automated equipment began to appear, but domestic packaging equipment companies can only master the traditional technology. Until now, only a few companies can independently design and use high-precision electromechanical design and control technologies such as linear motors and digital motion control systems. . Most of the company's core modules still only choose to outsource, especially the cost and core competitiveness of core equipment (solid crystal, wire bonding machine) and the international companies such as ASM have not narrowed, but have become more and more.
Unfinished , please refer to the March issue of Gaogong LED 's " LED Good Products" magazine.
At present, the COB package structure has gradually matured in technology, and the product structure, size, and model have also appeared relatively standardized products. At the same time, everyone is researching new COB-derived structures, making heat dissipation, process simpler, and lower cost based on improved light efficiency.
From the current market reaction, the device has gradually entered the mass production plan of large-scale packaging enterprises. From Citizen, Sharp, Japan, which is the first to participate in COB, to the current American Curry, many LED lighting giants have also developed COB-based light sources. The solution, the market also began to provide matching reflectors, lenses and other accessories.
“COB is mostly packaged in small chips, and the price per watt is very close to the price of a single high-power chip.†In the view of Fu Xiaohui, general manager of Shenzhen Huagao Optoelectronics Technology Co., Ltd. (hereinafter referred to as “Hua Gao Optoelectronicsâ€), 9W The overall cost advantages of the above COB solutions are gradually emerging, and it is easier to implement a light engine solution.
Original MRCOB technology
"The key to the breakthrough in the efficacy of our packaged devices lies in our patent - MRCOB's new packaging technology." Fu Xiaohui said that MRCOB belongs to COB's fourth-generation upgrade technology, which directly places the chip in Substrate heat sinking on metal, which shortens the heat dissipation path, reduces thermal resistance, improves heat dissipation, and effectively reduces the junction temperature of the light-emitting chip. At the same time, it overcomes many technical problems such as the structure, materials and processes of previous generations of MCOB products.
" Reflector is the meaning of reflection. It is the light that will be collected to the maximum extent. The light in the light source is better reflected by the CAE professional design analysis platform." Fu Xiaohui said that by mimicking the structure of the reflector, the light extraction efficiency can be improved. . At present, the company's laboratory products have exceeded 178lm/, and are currently seeking ways to further reduce costs. At the same time, the MRCOB packaged device has formed mass production capability, and the light efficiency has exceeded 120 lm/W, indicating that it has reached 80.
In the product line, Huagao Optoelectronics packaged devices have introduced three series of products: copper substrate, aluminum substrate and ceramic substrate.
Fu Xiaohui introduced that the current X series aluminum substrate products have exceeded 120lm/W under the condition of 80. The copper substrate is basically the same as the aluminum substrate in light efficiency, but the price is slightly higher, but the heat dissipation will be better. Especially in the case of small volume, the advantage is obvious. The T-series ceramic substrate MRCOB products are currently under the condition of 80, the light efficiency has exceeded 110lm/W.
Encapsulating peripherals opportunities
After years of development, the LED industry has gradually entered the stage of scale, and production efficiency, product quality and cost control are the first issues that enterprises need to consider.
From 2000 to 2005, it was the budding stage of domestic packaging equipment. The packaging practice of small workshops gave a certain development space for domestically produced equipment.
From 2005 to 2010, especially after 2008, the LED lighting industry gradually gained the attention of governments at all levels in mainland China. During the period, semi-automated packaging equipment became popular. Many domestic packaging equipment companies chose to introduce simple and low-grade domestic applications. Cost, semi-automated equipment.
After 2010, the demand for fully automated equipment began to appear, but domestic packaging equipment companies can only master the traditional technology. Until now, only a few companies can independently design and use high-precision electromechanical design and control technologies such as linear motors and digital motion control systems. . Most of the company's core modules still only choose to outsource, especially the cost and core competitiveness of core equipment (solid crystal, wire bonding machine) and the international companies such as ASM have not narrowed, but have become more and more.
Unfinished , please refer to the March issue of Gaogong LED 's " LED Good Products" magazine.
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