The hot summer is coming. For those users who have a feverish mobile phone, I am afraid that I have to play the game in this season. Under the steaming of nearly 40 degrees, don't mention playing games. I am afraid that brushing a web page can obviously feel that the mobile phone is desperately releasing heat to protest. We know that the damage caused by fever to mobile phones is very serious, and it also greatly affects the user experience. Mobile phone manufacturers must also know this well, so the problem of heat dissipation for mobile phones has always maintained a high degree of attention. Various heat dissipation technologies are also emerging one after another. Today, let us take a look at the technologies that currently have heat dissipation.
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Before discussing heat dissipation technology, it is also necessary to understand the main causes of mobile phone fever. First of all, there are two main sources of fever in mobile phones, one is from the mobile phone SOC chip, and the other is from the fever during charging and discharging. The heat of the mobile phone chip mainly depends on the design capability of the chip manufacturer. With the continuous improvement of the performance of the chip and the improvement of the overall integration of the SOC, it is reasonable to have a fever problem in the operation of the chipset, but the manufacturer should have the ability to The heat control is within an acceptable range, and if there is a major design error, the heat of the mobile phone will increase.
For example, Qualcomm Xiaolong 810 is a typical case. The high fever that has not been retired is not known how many mobile phone manufacturers broke down in this year. The reason is that the internal process design of the chip has made a major mistake. At the same time, mobile phone manufacturers are also more important factors in optimizing chip heating, such as Sony Z3+. In the daily use of cameras, there are often things that will cause the camera to overheat after taking a few photos, and then automatically close the game. The 810 mobile phone did not have such a low-level vulnerability, which shows that this is too weak for Sony to optimize the heat of the mobile phone chip. In this case, let's take a look at what other mobile phone manufacturers are currently using to alleviate the fever problem.
1, graphite patch
This method is the most common method of cooling and is used by most manufacturers. A layer of graphite heat-conducting layer is applied on the SOC of the mobile phone, and the heat conduction of the graphite is used to conduct heat to the back cover of the mobile phone and the heat dissipation portion of the frame for heat dissipation when the mobile phone works hot. In general, the thermal conductivity of metal materials is better than that of plastics. The heat transfer is fast and the heat dissipation is fast, but there is also a disadvantage that the user's feeling of heat on the mobile phone will be more obvious.
2, ice nest cooling technology
Ice nest cooling is a self-developed mobile phone cooling technology for OPPO smart phone application on OPPO R5. It introduces a new liquid metal heat-dissipating material, which allows the normal heat generated during the working process of the mobile phone to be quickly and evenly discharged. Ice nest cooling requires a new attempt on PCB board design. Because the heat-conducting medium is a liquid metal-like material, according to the conventional PCB board design, close to the CPU and other ICs will cause short-circuit problems, so the OPPO adopts a single-sided layout method, and closes the liquid metal behind the CPU and other large heat-generating households. The material's thermal sheet, after the temperature rises, the liquid metal changes from solid to liquid, filling the gap with the middle frame, insulating the air, improving the heat transfer efficiency, thereby greatly improving the heat dissipation speed. Compared with the traditional heat dissipation method, this method greatly improves the heat dissipation efficiency of the mobile phone.
3, active cycle nano thermal fluid
This method of heat dissipation uses an active cycle approach. First, a copper hollow tube is added to the mobile phone, and a special nano thermal fluid is added to the catheter. When the mobile phone chip generates heat due to calculation, the thermal energy is absorbed by the nano thermal fluid in the copper tube. After being heated, the nano thermal fluid vaporizes and flows in the hollow conduit. When flowing to a low temperature, the heat energy is released and condensed into a liquid state to complete the heat of the mobile phone. Quickly transfer and scatter. At the same time, the condensed thermal fluid will flow again to the key heat-generating chips such as AP and BP.
4, software optimization
Compared with the hardware optimization method mentioned above, software optimization is more like a method of saving the country by curve. This is also the method adopted by many mobile phone manufacturers. The technical requirements are relatively low, and it is usually included in the self-owned mobile operating system ROM. Increase the control of the background resident application to improve the execution efficiency, but also relieve the CPU's working pressure and reduce heat. At the same time, it can also reduce the frequency of the mobile phone CPU properly, although it will lose some performance, but it will not affect the user's use. Under the premise, this is also a relatively good solution.
In the future, I believe that the performance of mobile phone chips will continue to improve, and the heat problems that follow will become more and more serious. However, we also believe that technology is always improving, and there will be better mobile phone cooling solutions in the future. We can imagine that in the future, we will use mobile phones to play large games, open a lot of applications, and the mobile phone can maintain a lower temperature. At that time, the smartphone must be stable in performance and security. There will be a bigger leap. Let us look forward to that day.
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