Electronic fully automatic operation interface: on this interface, fully automatic start and stop buttons, equipment working state simulation display graphics and parameter value display of each process tank, such as: temperature value, concentration value, flow value, ultrasonic working state display lamp , Ultrasonic frequency value, etc. Process flow simulation interface: This interface simulates the whole process of the process flow, with corresponding parameter display and dynamic display in important positions. Fault alarm screen: when the device fails or a certain process parameter is abnormal, this screen will pop up automatically, the device sound and light alarm to reveal the operator's attention, at the same time display the fault status, text prompt fault description, and can automatically record the fault status, convenient The maintenance personnel analyzes the cause of the failure and automatically deletes the previous record when the storage area is full. Production report and process parameter printing interface: On this interface, you can print the production report and the historical records of the selected process parameters.
The single chip microcomputer program mainly includes the subroutine of ultrasonic generation, the subroutine of positive communication with PLC, the subroutine of ultrasonic feedback and adjustment, and the subroutine of interrupt service. The A port of the 8255 chip expanded in the single-chip microcomputer system receives the frequency signal of the PLC, and the B port receives the feedback signal of the frequency detection device. In order to prevent illegal personnel from invading the system and modifying process parameters, three levels of priority are set in the program. That is: (1) Engineer level; (2) Technician level; (3) Operator level. Each level corresponds to a different entry password, that is, a password input interface appears on the man-machine interface after the system is started. After three incorrect passwords are input, the system alarms and automatically shuts down. The operator-level authority is the lowest authority for selecting the process file and executing the operation.
DBC (Direct Bonded Copper) Substrate is a special process board where copper foil is bonded directly to the surface (single or double sided) of and AI203 OR AIN ceramic substrate at high temperatures and can be etched with various graphics. It has excellent electrical insulation performance, high thermal conductivity, excellent soft brazability, high adhesion strength and a large current-carrying capacity. DBC Substrate mainly used in the fields of rail transit, smart grid, new energy vehicles, industrial frequency conversion, household appliances, military power electronics, wind and photovoltaic power generation.
We custom high precision DBC Substrate with drawings provided by customers. The raw material we use for etched DBC substrate is Ceramic-based double-sided copper clad laminate. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve double-sided etching of different graphics with 0.3 mm - 0.8mm thickness of copper clad laminate. Also, we can guarantee that our double-sided copper clad laminate substrate is neatly arranged, straight surface line, and have no burr, high product accuracy.
Its superiorities of DBC Substrate are as follow:
1. A ceramic substrate with a coefficient of thermal expansion close to that of a silicon chip, which saves the transition layer of Mo chips, saving labour, material and cost.
2. Excellent thermal conductivity, making the chip package very compact, thus greatly increasing the power density and improving the reliability of systems and devices.
3. A large number of high-voltage, high-power devices have high requirements for heat dissipation, and ceramic substrates have a better heat dissipation effect.
4. Ultra-thin (0.25mm) ceramic substrates can replace beo, without environmental toxicity problems.
5. Large current carrying capacity, 100A continuous current through 1mm wide 0.3mm thick copper body, temperature rise of about 17 ℃; 100A continuous current through 2mm wide 0.3mm thick copper body, temperature rise of only about 5 ℃.
6. High insulation withstand voltage, to ensure personal safety and equipment protection
7. New packaging and assembly methods can be realized, resulting in highly integrated products and reduced size
8. The ceramic substrate is highly resistant to vibration and wear, ensuring its long service life.
High Precision DBC Substrate,Etched DBC Substrate,Double-Sided Copper Clad Laminate Substrate
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